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Specifications:
Size: 1.7*0.6*1.1 mm
Wavelength: 590nm
Brightness: 90mcd
Welding temperature: 260 degrees
Welding time: 3 seconds
| Color | Dominant Wavelength(nm)/(k) | LuminousIntensity(mcd) | 50%Power Angle(Deg) | Reverse Current(uA)VR=5V | Forward Voltage(V) | Recommend Forward Current(Ma) | POWER | packing |
| Red | 620-630nm | 100-200 | 120deg | 10 | 1.8-2.4 | 20 | 60mW | 4K/Reel |
| Blue | 460-470nm | 70-100 | 120deg | 10 | 2.8-3.5 | 20 | 90mW | 4K/Reel |
| Green | 520-530nm | 150-250 | 120deg | 10 | 2.8-3.5 | 20 | 90mW | 4K/Reel |
| Orange | 600-610nm | 150-300 | 120deg | 10 | 1.8-2.4 | 20 | 60mW | 4K/Reel |
| Yellow | 585-595nm | 80-120 | 120deg | 10 | 1.8-2.4 | 20 | 60mW | 4K/Reel |
| White | 6000-7000k | 350-500 | 120deg | 10 | 2.8-3.5 | 20 | 90mW | 4K/Reel |
The five raw materials of LED are: chip, bracket, silver glue, gold wire, epoxy resin
1. Chip
1.1 The composition of the chip: It is composed of gold pad, P pole, N pole, PN junction, and back gold layer (dual pad chip without back gold layer).
1.2 Definition: A wafer is a PN combination composed of P-layer semiconductor elements and N-layer semiconductor elements rearranged and combined by electron movement. It is this change that enables the wafer to be in a relatively stable state.
1.3 The light-emitting principle of the chip:
When a positive electrode is applied to the wafer by a certain voltage, the holes in the forward P area will continuously swim to the N area, and the electrons in the N area will move to the P area relative to the holes. While the electrons and holes move relatively, the electrons and holes pair with each other to excite photons and generate light energy.
1.4 Classification of chips:
1.4.1 Divided by luminous type:
Surface emitting type: most of the light is emitted from the surface of the wafer
Five-sided light-emitting type: more light is emitted from the surface and sides
1.4.2 According to the luminous color:
Red, orange, yellow, yellow-green, pure green, standard green, blue-green, blue
2. Bracket:
The structure of the bracket:
1st floor is iron
2-layer copper plating (good conductivity, fast heat dissipation)
3 layers of nickel plating (anti-oxidation), 4 layers of silver plating (good reflectivity, easy wire bonding)
3. Silver glue (due to more types, we take H20E as an example)
Also called white glue, milky white, conductive bonding effect (baking temperature: 100°C/1.5H)
Specifications:
Size: 1.7*0.6*1.1 mm
Wavelength: 590nm
Brightness: 90mcd
Welding temperature: 260 degrees
Welding time: 3 seconds
| Color | Dominant Wavelength(nm)/(k) | LuminousIntensity(mcd) | 50%Power Angle(Deg) | Reverse Current(uA)VR=5V | Forward Voltage(V) | Recommend Forward Current(Ma) | POWER | packing |
| Red | 620-630nm | 100-200 | 120deg | 10 | 1.8-2.4 | 20 | 60mW | 4K/Reel |
| Blue | 460-470nm | 70-100 | 120deg | 10 | 2.8-3.5 | 20 | 90mW | 4K/Reel |
| Green | 520-530nm | 150-250 | 120deg | 10 | 2.8-3.5 | 20 | 90mW | 4K/Reel |
| Orange | 600-610nm | 150-300 | 120deg | 10 | 1.8-2.4 | 20 | 60mW | 4K/Reel |
| Yellow | 585-595nm | 80-120 | 120deg | 10 | 1.8-2.4 | 20 | 60mW | 4K/Reel |
| White | 6000-7000k | 350-500 | 120deg | 10 | 2.8-3.5 | 20 | 90mW | 4K/Reel |
The five raw materials of LED are: chip, bracket, silver glue, gold wire, epoxy resin
1. Chip
1.1 The composition of the chip: It is composed of gold pad, P pole, N pole, PN junction, and back gold layer (dual pad chip without back gold layer).
1.2 Definition: A wafer is a PN combination composed of P-layer semiconductor elements and N-layer semiconductor elements rearranged and combined by electron movement. It is this change that enables the wafer to be in a relatively stable state.
1.3 The light-emitting principle of the chip:
When a positive electrode is applied to the wafer by a certain voltage, the holes in the forward P area will continuously swim to the N area, and the electrons in the N area will move to the P area relative to the holes. While the electrons and holes move relatively, the electrons and holes pair with each other to excite photons and generate light energy.
1.4 Classification of chips:
1.4.1 Divided by luminous type:
Surface emitting type: most of the light is emitted from the surface of the wafer
Five-sided light-emitting type: more light is emitted from the surface and sides
1.4.2 According to the luminous color:
Red, orange, yellow, yellow-green, pure green, standard green, blue-green, blue
2. Bracket:
The structure of the bracket:
1st floor is iron
2-layer copper plating (good conductivity, fast heat dissipation)
3 layers of nickel plating (anti-oxidation), 4 layers of silver plating (good reflectivity, easy wire bonding)
3. Silver glue (due to more types, we take H20E as an example)
Also called white glue, milky white, conductive bonding effect (baking temperature: 100°C/1.5H)
