Green Side 1206 SMD LED Chip

Specification:

Size: 1.2*0.6mm

Wavelength: 520-525NM

Brightness: 100-400MCD

Welding temperature: 260 degrees

Welding time: 3 seconds

• Color	Dominant Wavelength(nm)/(k)	LuminousIntensity(mcd)	50%Power Angle(Deg)	Reverse Current(uA)VR=5V	Forward Voltage(V)	Recommend Forward Current(Ma)	POWER	packing
  Red	620-630nm	100-200	120deg	10	1.8-2.4	20	60mW	3K/reel
  Blue	460-470nm	150-300	120deg	10	2.8-3.5	20	90mW	3K/reel
  Green	520-530nm	500-600	120deg	10	2.8-3.5	20	90mW	3K/reel
  Orange	600-610nm	100-200	120deg	10	1.8-2.4	20	60mW	3K/reel
  Yellow	585-595nm	100-200	120deg	10	1.8-2.4	20	60mW	3K/reel
  White	10000-15000k	500-700	120deg	10	2.8-3.5	20	90mW	3K/reel

• Size: 3.2*1.0*1.5MM

• Wavelength: 520-525NM

• Brightness: 100-400MCD

• Welding temperature: 260 degrees

• Welding time: 3 seconds

The five raw materials of LED are: chip, bracket, silver glue, gold wire, epoxy resin

1. Chip

1.1 The composition of the chip: It is composed of gold pad, P pole, N pole, PN junction, and back gold layer (dual pad chip without back gold layer).

1.2 Definition: A wafer is a PN combination composed of P-layer semiconductor elements and N-layer semiconductor elements rearranged and combined by electron movement. It is this change that enables the wafer to be in a relatively stable state.

1.3 The light-emitting principle of the chip:

When a positive electrode is applied to the wafer by a certain voltage, the holes in the forward P area will continuously swim to the N area, and the electrons in the N area will move to the P area relative to the holes. While the electrons and holes move relatively, the electrons and holes pair with each other to excite photons and generate light energy.

1.4 Classification of chips:

1.4.1 Divided by luminous type:

Surface emitting type: most of the light is emitted from the surface of the wafer

Five-sided light-emitting type: more light is emitted from the surface and sides

1.4.2 According to the luminous color:

Red, orange, yellow, yellow-green, pure green, standard green, blue-green, blue

2. Bracket:

The structure of the bracket:

1st floor is iron

2-layer copper plating (good conductivity, fast heat dissipation)

3 layers of nickel plating (anti-oxidation), 4 layers of silver plating (good reflectivity, easy wire bonding)

3. Silver glue (due to more types, we take H20E as an example)

Also called white glue, milky white, conductive bonding effect (baking temperature: 100°C/1.5H)